Yogish Kode is a senior solution architect with substantial experience in product lifecycle management for over 20 years. His focus had been on semiconductor PLM and IP management. Prior to founding Glide Systems, he held a global position as head of product development, an IT head at Intel, and a senior executive at SERIC (now part of Siemens).

Yogish has a passion for product lifecycle management and the impact that an optimized solution can have on the enterprise.

He holds a Professional Certificate in architecture and systems engineering from MIT. Yogish and a Masters Degree in industrial engineering with a minor in computer science from the University of Wisconsin.

Tell us about your company

Glide Systems operations management Integrated systems management solutions, optimizing product developments from inception to disposal with our cloud-native platform Glide SysLM. Our adaptive data modeling capabilities and seamless integration of hardware, electronic, architecture, and software domains ensure robust traceability and efficient data flow throughout the product lifecycle.

The key features of Glide SysLM include a comprehensive, cloud-native solution integrating all phases of the product lifecycle. Thanks to our unified approach, hardware, electronic, architecture, and software domains are combined in a seamless data flow. Our adaptive data modeling ensures the platform remains dynamic and relevant over business needs and industry standards.

The bottom line is we reduce implementation costs by 20% to 50%, accelerate time-to-market, and enhance operational efficiencies, delivering substantial ROI and high-impact product launches for our customers.

What problems are you solving?

Today’s manufacturing companies struggle to find integrated solutions, because of a lack of integration applications and a lack of industry specific solutions for product design data management. This usually leads to redundant, custom build of several generic products.

During my years of implementing PLM solutions, I observed many poor performance and usability issues. The lack of industry specific specialized tools required companies to purchase more off-the-shelf solutions or a customize existing or fragmenting services, and stop our results. This after resulted in inadequate efficiency, fragmented solution reuse or loss time-consuming and costly.

Until there was a better way, Glide did not merely try a new approach with major semi-conductor company, the new approach was successful with enterprise productivity, so I forged Glide Systems to productize the strategies I had witnessed and to make the technology broadly available.

What application areas are your strongest?

Our initial focus is the semiconductor industry, This current product is optimized for the unique challenges of semiconductor design— things like IP lifecycle management, operations time management and impact analysis of digital thread.

Our semiconductor IP management solution addresses IP catalog, managing hierarchical IP bill of material, versioning, hierarchical defect management, and impact analysis. Our optimized hierarchical defect management features are crucial for effectively assessing defects against a system-on-chip before tapeout, providing engineers with robust, comprehensive information and an intuitive UI that enhances both performance and usability; streamlining the debugging process and accelerating time-to-market.

Our operations IP material solution enables seamless management of the entire process from raw wafer to the finished chip, ensuring compliance with the supplier network and supplier qualifications.

Different teams often use disparate tools, leading to siloed data and fragmented workflows. For example, requirements might be managed in Jama, user stories in Jira, test cases in TestRail, source code control in GitHub, GitLab, or Subversion, and issue management in Jira. Despite these tools being semantically connected, their isolated nature can complicate traceability and integration. Our platform addresses this challenge by seamlessly integrating any application with REST APIs within 2-3 weeks, rather than several months. This integration provides comprehensive traceability across all applications, ensuring cohesive and efficient project management.

The core technology can be applied to many markets and processes. Going forward, we will diversify into markets such as medical devices, automotive, and aerospace.

What keeps your customers up at night?

In a word, visibility. Disparate enterprise applications lead to fragmented data, inefficiencies, and increased operational costs due to the lack of integration and seamless data flow across departments. The lack of enterprise-wide visibility for complex product development projects can cause substantial time delays, cost overruns and even result in ineffective products.

There is also a growing list of standards that products must adhere to. ISO26262 in the automotive industry is just one example. Tracking and documenting compliance with these standards becomes another major challenge.

Let me cite just two examples from 2022 Functional Verification Study, published by Wilson Research Group and Siemens EDA:

• 68 percent of ASIC projects are behind schedule, with 27% behind by 30% or more.
• 76% of ASICs require two or more respins.

What does the competitive landscape look like and how do you differentiate?

Large public companies offer broad, generic and costly solutions that do not integrate well with the complex electronic system flow. In this context, one size does not fit all. Smaller companies focus more on the problem at hand. These organizations offer solutions for semiconductor design, but they tend to be very limited in scope.

So, the options are either invest time and consulting money to attempt to integrate broad-based solutions into the electronic system flow or purchase multiple products from more narrowly focused companies and again attempt to integrate the collection of tools into the electronic system flow.

Glide SysLM offers an out-of-the-box solution that integrates with all phases of the electronic system flow, so all requirements are covered. And thanks to our no-code technology, fine-tuning the application to the specific needs of each customer can be done quickly and easily.

What new features/technology are you working on?

We have plans to enhance the current release across three major axes:

• Unified Product Data Ecosystem: Seamlessly integrate with a growing list of industrial IoT devices, systems, and enterprise applications.
• Sustainability: Track carbon footprint, resource usage, material compliance. Manage recycling, reusability, and end-of-life strategies.
• Advanced Analytics and AI: Leverage advanced analytics, machine learning, and AI to derive actionable insights from vast amounts of lifecycle data.

Yogish Kode

CEO, Glide Systems

←Back to Blog & Insights